Various products and solutions of LYG will be unveiled at Hon Hai Technology Day 2023
10月18日，富士康科技集团举办“2023鸿海科技日(HHTD 23)”，正式发…
LYG officially joined Hengqin Guangdong-Macao Deep cooperation zone semiconductor industry Association
日前（9月20日），横琴粤澳深度合作区半导体行业协会（下称“横琴半导体行业协会”…
LYG debut 2023 ELEXCON Shenzhen International Electronics Exhibition
LYG debut 2023 ELEXCON Shenzhen International Electronics Exhibition
摘要：凌烟阁芯片科技携芯片产品、系统方案模组亮相展会，并重点展示凌烟阁“高端工艺…
2023凌烟阁暑期芯片设计研习营 – 研习生采访
2023凌烟阁暑期芯片设计研习营回顾
LYG invites you to meet ELEXCON Shenzhen International Electronics Exhibition
8月23至25日，ELEXCON 2023深圳国际电子展将在深圳会展中心（福田）…
Lingyange is named One of the First Key Enterprises in the Backup Plan for Holding Companies Listed on the Main Exchange in Hengqin
日前（ 8月11日），横琴粤澳深度合作区（简称“合作区”）“琴澳投融易…
凌烟阁执行长李宏俊接受《未来半导体》专访
