LYG with chip products, system solution modules at the exhibition, and focus on the display of LYG's "high-end process design services" GPGPU product results
From August 23 to 25, 2023 Shenzhen International Electronics Exhibition and Embedded Systems Exhibition (ELEXCON) was held in Shenzhen Convention and Exhibition Center (Futian). LYG carried chip products and system solution modules at the exhibition, and focused on displaying the GPGPU product results of LYG's "high-end process design services".
As the vane of China's electronics, embedded and semiconductor advanced sealing and testing industry, ELEXCON Shenzhen International Electronics Show "high computing power, low power consumption, witness the influence of PPA for social intelligence!" As the theme, it attracted 600+ global quality brand manufacturers and 50,000+ professional visitors to the scene. It brings together the exhibition areas of automotive scale chips and components, power supply and energy storage, AI and computing power, Industrial IoT and AIoT, RISC-V open source ecology, Chiplet, SiP and advanced packaging, and more than 20 summit forums, presenting global industry dynamics and future technology trends.
As a technical service provider in the chip industry, LYG is committed to providing customers with a full range of chip design and system solution customization services, covering from chip design and customization services, mass production management, application solutions to channel sales, to achieve a complete industrial chain service process.
The company has participated in ELEXCON Shenzhen International Electronics Exhibition for the second consecutive year, and the team of Shenzhen Branch has demonstrated the company's comprehensive layout of IP, EDA tools and advanced system solutions in the application field of "high computing power and high performance, vehicle scale and high reliability", which has won the attention of many manufacturers.
Lingyange has developed its own high-performance computing IP, providing LYG has developed its own high-performance computing IP, providing self-developed low-power standard cells (highlight: can also perform chip functions under near threshold voltage operation), helping high-performance computing products achieve better power efficiency, and customized Sign off standards to achieve the best balance between power consumption and performance.
LYG self-developed Performance Monitoring and Analysis Platform (PMAP), which is an EDA result of LYG performance management software, can apply "performance monitoring and management" to customers' chip design, so as to analyze the difference in process performance data between chips, improve chip efficiency and yield, and predict the real life of chips. Help customers achieve true Design and Technology Co-optimization (DTCO). LYG provides scarce DTCO support for domestic chip design companies to help domestic high-end chip products land.
LYG self-developed high reliability IP, using the thick gate oxide cell library, double via plug cell library and other proprietary basic IP development technology, can be applied to the automotive, aerospace, medical and other fields of chip product design, to help customers achieve low power consumption, low leakage, anti-radiation and other high standard and high reliability application requirements.
LYG high power chip SiC MOSFETs are designed for high frequency and high efficiency systems. Low on-resistance, fast switching speed, easy parallel, controllable dV/dt to optimize EMI and reduce cooling requirements. Used in switching mode power supply, uninterruptible power supply, solar inverter, motor drive and other fields.
RGB-D depth camera is the fusion imaging solution of LYG's new 3D depth camera and RGB camera. The program has a high cost performance and high customization degree, and will also be used as one of the cooperation platforms for "design services" chip products in visual applications. The 3D imaging of LYG can output data streams including RGB data and depth data for machine reading, and the processing speed and overall cost are superior to the products of the same class. At the same time, according to the application requirements of the scene, through the integration of optics, intelligent hardware and algorithms, the corresponding depth map and point cloud map can be generated.LYG also holds multi-scene customization requirements, 3D imaging solution platform supports mainstream operating systems, and has excellent adaptability. The scheme is widely used in people flow statistics, gesture recognition, robot obstacle avoidance, vSLAM, robot navigation, 3D modeling, video conference and so on
The high-performance 4×Chiplet GPGPU acceleration board is the result of LYG's "high-end process chip design service". Through cooperation with well-known intelligent system customers in the industry, the GPGPU acceleration board design, product implementation and solution cooperation promotion are completed. The board is designed to accelerate deep learning and machine learning tasks and provide high-performance computing power for a wide range of applications including image and speech processing, natural language processing, pattern recognition, machine learning and deep learning, as well as various scientific operations. Boards can be installed in data center servers, edge devices, and embedded systems to provide efficient AI and high-performance computing capabilities. At present, it has been applied in the accelerated processing of biomedical images and promoted in many universities.
At the same time of displaying the products and solutions of LYG, the relevant solutions of our partner Hongyang Semiconductor were also displayed. Hongyang Semiconductor provides 6-inch SiC wafer foundry, including industrial and automotive Schottky secondary, power gold-oxygen half-effect transistor technology platform, committed to foundry service quality, speed,
At this exhibition, LYG hopes to use the professional platform of 2023 ELEXCON Shenzhen International Electronics Exhibition to fully demonstrate LYG's professional technology and quality service, link resources up and down the industrial chain, and empower customers in an all-round way.