From August 23 to 25, ELEXCON 2023 Shenzhen International Electronics Fair will be held in Shenzhen Convention and Exhibition Center (Futian). Lingyange Semiconductor Inc. will appearat booth 1N52,looking forward to your visit.
In the exhibition area, LYG will exhibit products and system solutions such as high-power chipSiC MOSFET, RGB-D depth camera module, video conferencing instrument, high-performance 4*Chiplet AI acceleration board, and automotive MCU development platform.The company's system module development team has been deeply engaged in optical and vision sensor fusion solutions, and developed multi-sensor fusion 3D-ToF technology, which is applied in a new generation of smart shopping carts to expand new markets for smart retail customers. Develop RGB+D depth cameras and application algorithms for robot vision and meta-universe concept products (such as AR/VR products) to help industry customers quickly achieve product landing.
LYG has the industry's top chip design service team, providing complete chip design services, IP intellectual property development, wafer manufacturing outsourcing management, and system module design to integrated solution sales. Based on the rich upstream and downstream resources of the semiconductor industry and high-end customer project service experience, the company deeply integrates chip design services with system development, provides a full range of technical services for industry customers, and enables the supply chain platform of Foxconn Technology Group to accompany and achieve the long-term development of customers.
The exhibition, with an exhibition scale of 60,000 square meters, is expected to attract 600+ global high-quality brand manufacturers and 50,000+ professional visitors to gather on the scene to create electric vehicles, power and energy storage, embedded and AIoT, SiP and advanced packaging and other industry innovation display and more than 20 summit forums to show global industry dynamics and future technology trends.
