High Performance Computing Products

Based on the cooperation opportunity between Lingyange and AI chip customers, our R&D personnel can obtain first-hand product information from the chip original factory, and design - produce high-precision computing acceleration and AI application boards related to it.
In addition to a sound design team, Lingyange also has outsourcing resources from the group, which can design and customize production boards, motherboards, and complete box build for customers.

SI Design and Simulation:
● High-speed Signal SI Design and Testing Capability
PCIE Gen5/Gen4
UPI 2.0/XGMI3/CCIX
SATA3.0/SAS3
USB3.0
56G PAM4/56G NRZ/25G NRZ
DDR5/DDR4/LPDDR5/LPDDR4X

●Retimer/Redriver/Expander Selection Experience
PCIE Gen5/Gen4
SATA3.0/SAS3

●PCB Design and Research
Stackup: 22L+
Material: M7 level/Hybrid/Temperature effects
Process: HDI/POFV/LowLoss SM/Low oxide brown
Utilization evaluation

●Cable/Connector Selection Experience
Internal: MCIO/ASM/GenZ/SlimSAS/CEM cable
External: CDFP/QSFP-DD/QSFP/Mini SAS HD

Power Design and Simulation
●Non-isolated DC/DC
Intel CPU/DIMM Power,VR11~VR14,IMVPx (15W-350W)
AMD Napl
High current GPU chip Core Power(600A)
DC/DC Buck, Boost, LDO(0.1W~135W)
Hot Swap Control, Efuse, Oring(5W~600W)

●BBU (Battery backup Module)
Charger
Discharge Power Path Control
Protection and Gas Gauge
Li-ion Battery Learning

●POE
Power Over Ethernet(802.3bt,100W)

●Isolated AC/DC, DC/DC
Boost PFC
LLC Resonant
Phase Shifted Full Bridge
Active Clamp Forward
Flyback

●Others
6KV CM/6KV DM Lightning Protection Design
EMC design, debug experience
TEC Power Supply Control of Semiconductor Cooler
AC/DC PSU model selection , customization and testing (500W - 3000W)

Layout Design Experience:

Heat Dissipation Design Capability：