Remain true to our original aspiration
and go on the journey of "core"
Lingyange Semiconductor Inc. is a high-tech enterprise focused on chip design, research and development, and sales. We have a passionate, technologically advanced, and highly competent team dedicated to providing the best quality chips and system solutions for customers worldwide.
We are eager to work with talented and responsible people who have dreams and are willing to take risks. As long as you are brave enough to challenge, innovate, and are interested in the chip industry, we welcome you to join us.
At Lingyange, we provide our employees with competitive compensation and benefits, comprehensive training opportunities, and broad career development opportunities. We focus on employee work-life balance and strive to create a comfortable working environment for our employees.
Please send your resume to the email address of the company's Human Resources Department:
hr@lyg-semi.com
ASIC CAD Technical Manager
Job Description:
- Establish an automated process for chip design, and be responsible for maintenance and optimization;
- Establish and build a design environment for specific projects, provide user support during the project, solve Linux/EDA and other environment setting problems, build an automated design platform, version control system, and maintain a technical library;
- EDA software evaluation, advanced process evaluation;
- Establishment of advanced technology test chip process;
Job Requirements
- Experience in CAD or chip design, familiar with mainstream EDA tools and process principles, practical planning, construction and maintenance of CAD environment is preferred;
- Proficient in scripting languages (Tcl/Perl/Shell/Python, etc.);
- Bachelor degree or above, 5-10 years of work experience；
- Good teamwork and planning skills;
- Strong self-management and proactive problem solving.
Chip Design Project Manager
Job Description:
- Responsible for the project management of chip R&D, coordinate R&D, market, production and operation and other resources, and complete the chip development and delivery work in strict accordance with the product development process;
- Responsible for the formulation and implementation of the project plan, responsible for organizing the review of important nodes, responsible for coordinating and promoting the work of each related team, and controlling the overall progress and risk of project development;
- Assist the functional safety team to complete the functional safety and information security certification of products;
- Collect and summarize the data in the implementation process of the company's various projects, and report to the company on a regular basis;
- Participate in the process improvement of the chip-level product management system.
Job Requirements
- Bachelor degree or above in science and engineering, 5-10 years of work experience, major in electronics, communication, computer and other related majors;
- Knowledge and skills in project management, understanding of project management processes, system frameworks, methods and strategies;
- Familiar with the chip development process, experience in the whole process of chip development from project approval to mass production is preferred;
- Excellent communication and coordination skills, team and cross-departmental collaboration skills;
- Strong ability to work under pressure, proactive, and have a high sense of responsibility;
- Experience in automotive-grade product projects, functional safety ISO26262 related experience is preferred.
Mass Production System Development Engineer
Job Description:
- Responsible for the development and maintenance of semiconductor production and test management systems;
- Responsible for the import and export of production data;
- Responsible for the operation management and backup of the system;
Job Requirements
- Able to work independently;
- If necessary, it is necessary to be able to cooperate with the project development and allocate working hours;
- Familiar with PHP/MySQL/HTML5/CSS/Javascript/jQuery/Ajax;
- Familiar with SQL;
- Familiarity with Java or Python;
- Experience in Web UI interface design and various statistical chart design;
- Have the ability to adjust the performance of the database and detect errors;
- Have a major in computer or information technology or electronics or other related majors in school or workplace;
- Experience in Web Application development;
- Experience in Web UI interface design and various statistical chart design.
Chip Test Engineer
Job Description:
- MCU, BCD, PMIC chip test program development;
- Chip testing and production management;
- Planning and arrangement of chip test tools;
Job Requirements
- 1-3 years of experience in chip testing;
- C/C++ program development ability;
- Ability to design and develop Excel charts and tables;
- Good communication skills, pay attention to teamwork;
- Able to work independently;
- Cooperate with the development of the case to allocate working hours;
- Cooperate with production needs for business trips;
Senior Package Design Engineer
Job Description:
- Package type, IO layout and ball map evaluation
- Work on package design including substrate layout, RDL, interposer, etc. Work with electrical/thermal simulation engineer to optimize package design.
- Work with OSAT on the design review, risk assessment and approve/release package drawing.
- Technical review with OSAT and substrate supplier, regularly update package design rule.
- Drive package development process, solve technical issues during NPI and HVM.
Job Requirements
- Bachelor degree or above, 5-10 years of work experience, professional background in electronic packaging, materials science engineering, electronic science and technology, etc.;
- Location (Shanghai or Zhuhai)
- Expert in package design EDA tools like Cadence allegro、AUTOCAD、CAM、etc.
- Familiar with various package type and process flow especially on laminate package. Familiar with advanced packaging knowledge like 2.5D, Fan-out would be a plus.
- Experienced with electrical or thermal simulation would be a plus.
- Experienced with complex/high speed signal design, SiP design, Chiplet design would be a plus.
- Familiar with packaging process, cost, performance, and reliability - Strong sense of teamwork and responsibility, with good interpersonal skills.
Senior Chip Physical Verification Engineer (Full Chip)
Job Description:
- Responsible for building, optimizing, and improving the PV flow;
- Responsible for organizing the PV signoff and checklist;
- Familiar with Design Rules for different processes, responsible for analyzing and solving various issues such as DRC, LVS, ERC, ESD, LUP, etc;
- Familiar with advanced process layout, responsible for organizing PV guidelines and improving design efficiency.
Job Requirements
- Familiar with Linux development environment, familiar with scripting languages such as Tcl/Perl/Shell/Skill;
- Proficient in using mainstream EDA tools such as Calibre/ICV;
- Familiar with Design Rule languages such as SVRF/TVF;
- bachelor’s degree or above, with 7 years or more of PV work experience;
- Have experience in multiple successful chip casting projects, with advanced process chip Tape out experience such as 16nm/7nm/5nm;
- Strong stress resistance, serious work attitude, good work enthusiasm and sense of responsibility, good logical thinking ability and document writing ability.
Senior Digital Back-end Engineer
Job Description:
- Familiar with the digital backend APR process, responsible for the physical design of block levels from RTL to GDS;
- Familiar with the STA process, responsible for timing analysis and closure of block levels;
- Familiar with the physical verification process, with DRC/LVS/ANT analysis and problem-solving abilities;
- Familiar with power consumption analysis and evaluation, with certain IR/EM analysis and verification capabilities;
- Proficient in using scripting languages and possessing certain skills in Design Flow development and maintenance.
Job Requirements
- Familiar with Linux development environment and commonly used text editing tools in Linux, familiar with scripting languages such as Tcl/Perl/Python/Shell;
- Proficient in using backend tools such as Cadence/Synopsys;
- Bachelor's degree or above, with 3 years or more of experience in digital backend work;
- Those with advanced process experience of 16nm or above, Top design experience, and familiarity with DDR, PCIe, Serdes and other IP technologies are preferred;
- Serious work attitude, good work enthusiasm and sense of responsibility, good logical thinking ability and document writing ability.
