On October 18, Foxconn Technology Group held the "2023 Hon Hai Technology Day (HHTD 23)", officially released the MODEL N electric logistics vehicle and the MODEL B mass production version of the cross-border leisure, and expanded the scale of the exhibition area to show the integration strength of Foxconn's three platform solutions in smart manufacturing, smart electric vehicles and smart cities.LYG brought a variety of products and solutions to participate in this science and technology day, showing the innovation achievements in the past three years.
In Taipei Nangang Exhibition Hall, LYG carefully displayed PMAP 2.0, high-reliability IP solution, 3D ToF + RGB multi-sensor fusion solution, high-performance acceleration board, high-reliability automotive MCU development platform, D-TOF sensor, etc., attracting group leaders and guests to visit.
PMAP 2.0 （Performance Monitoring Analysis Platform）is composed of two components: the first component is the performance monitoring circuit, which is responsible for collecting the hardware IP of the electrical data during chip operation; The second component is the data analysis platform, which is a software tool for data storage, management and analysis. With PMAP 2.0, the process data analysis can be simplified and more internal chip data can be obtained.
Our ring oscillation sensor in PMAP 2.0 has dozens of designs, each using different transistors and logic gates, which can effectively amplify and measure the electrical parameters of different transistors. We look forward to PMAP 2.0 as an automated solution to improve SoC system-level chip process and design interactions, and to provide customers with an automated solution to monitor the lifetime of high-reliability products.
High reliability chips focus on the design point of view to solve the defects that may occur in the manufacturing process, these manufacturing defects do not necessarily appear in the early stage of the product, but after the chip is used for a period of time, it will cause circuit failures inside the chip. Aiming at the design scheme of high reliability chip,LYG has developedhigh voltage anti-noise component library and double inner plug standard component library. The High voltage anti-noise Component Libraryis a standard component circuit designed using transistor components with high thickness gate oxide layers in the process.LYA offers more than 200 standard components with high thickness gate oxide layers. Compared with standard components supplied by fabs, we reduce leakage current by more than 60% and suppress most of the power noise.The Double VIA/CONTACT standard cell libraryutilizes circuit layout skills and design capabilities to effectively add double internal plugs to the standard component designs provided by fabs to strengthen the internal connections of transistors. With more than 700 standard components with double internal clots, we can extend the mean time to failure (MTTF) by more than 2 times compared to fabs, even when operating at high temperatures of 125 degrees, which means improved reliability. LYG standard component library can be widely used in automotive, medical and industrial products.
The high-performance 4×Chiplet accelerator board is an accelerator board for GPGPU chips designed and produced by LYG and customers using chip modular technology (Chiplet). The board is designed to accelerate deep learning and machine learning tasks and can also provide high-performance scientific computing power. Chip modular technology (Chiplet) integrates chips with different functions and processes on a silicon substrate through modular design and advanced packaging technology, so that each chip component (such as computing unit, storage unit, communication interface, etc.) can focus on different tasks with its strengths. At the same time, higher design flexibility, stability, operation efficiency and production benefits are obtained. The advantage of Chiplet is the elastic configuration of algorithm computing power, which can quickly provide customers with the required solution according to the application needs, without the need to re-stream the chip, and the chip yield is higher than SoC. Compared with a single chip, the chip modularity of Chiplet technology can achieve performance customization, scalability of computing power and algorithms, and can save costs, and the product can be widely used in various high-performance computing and AI training scenarios.
The high reliability automotive MCU development platform of LYG adopts Magpie-A1 chip designed in accordance with ISO26262 vehicle safety specifications, equipped with 32-bit RISC-V core. In order to ensure the functional safety of the chip, In Magpie-A1, the Dual Core Lockstep safety mechanism is designed to prevent single-core operation failure and improve the reliability of system operation. The Magpie family of automotive MCU platforms features a modular design of IP that allows flexibility in combining required functions and supports a variety of control and protection mechanisms. The platform can also be paired with a hardware safety module (HSM) and a complete software and hardware development environment to meet the design needs of automotive networking, motor control, safety, and low power consumption. Customers can directly reuse LYG MCU development platform, but also on the existing basis for secondary development.
LYG 3D ToF + RGB multi-sensor fusion scheme, the system scheme integrates ISP, dual-lens optical correction, image fusion, machine vision and other algorithms. Unique algorithm, can optimize the adaptability of various scenarios; Standard USB 2.0 components, plug and play on UVC platform; Provide customized PCB services to help customers shorten the time to market; The solution provides Windows, Linux, ROS background SDK kits for customers to secondary development, support depth map, IR map, point cloud map +RGB map and other data output.
Albert Li, CEO of LYG, said that around the group's "3+3" strategy, LYG continues to increase the construction of talent teams and strengthen scientific research investment, in addition to the ability to achieve high-end process projects below 6nm, LYG has the ability to develop high-efficiency and high-reliability IP and independent AI algorithm with chips. At present, in the aspect of high-end process chips, design process collaborative optimization is a necessary tool, and LYG is one of the few companies that can do DTCO chip design services. At the same time, LYG is a new generation of design services DS 3.0, with greater development prospects.
In the future, LYG will continue to assist chip customers to develop efficient and reliable chips, assist system customers to plan complete software and hardware solutions, ensure that the Group and customers lock in a stable and reliable source of chip supply, and connect more chip customers into the Group and the global semiconductor supply chain.