2022-11-08
From November 6 to 8 , the three-day ELEXCON 2022 Shenzhen International Electronics Exhibition and Embedded Systems Exhibition was held at the Shenzhen Convention and Exhibition Center. More than 400 brands from over 20 categories gathered at the exhibition. Lingyange Semiconductor Inc. (hereinafter referred to as "LYG") participated in the exhibition for the first time with a variety of chip products, strengthening exchanges and cooperation with upstream and downstream enterprises through professional exhibitions.
At this exhibition, LYG exhibited products such as optocoupler , TVS (Transient Voltage Suppressor), and RGBD. Among them, the TVS chip, which is only the size of a fingernail, can more effectively suppress voltage to protect circuits, absorb larger pulse peak currents, and be applied in faster speed scenarios, helping customers solve the ESD (meaning "electrostatic discharge") problem faced in advanced processes. In terms of system applications, LYG RGBD is an integrated optical, mechanical, and electrical system solution that can collect depth information and RGB images of objects in the field of view in real-time, with unique algorithms optimizing adaptability for various scenarios. This product is widely used in crowd counting, gesture recognition, robot obstacle avoidance, robot navigation, volume measurement, live detection, haptic interaction, 3D modeling, video conferencing, etc.
It is understood that LYG was established in Hengqin in June 2020 based on Foxconn's chip design service team. The company provides complete chip design services, IP intellectual property development, wafer manufacturing outsourcing management, and a complete solution from system module design to channel sales, dedicating itself to becoming a first-class domestic chip design and complete service company. LYG focuses on the development of high-performance computing chips, automotive chips, and security chips, and extends its technical services to system applications, promoting the integration of optical and visual sensors, and cooperating with the University of Macau to conduct application research in the field of biomedicine.
It is understood that this exhibition has set up four major exhibition areas: 5G new technology and application, automotive-grade chips and components, embedded and AloT, SiP and advanced packaging and testing. More than 400 brand companies from over 20 categories have gathered for the exhibition, with an estimated 40,000 professional visitors expected to attend. In addition, more than 20 professional forums will be held during the same period.
The report is from: Guan Hai Media
Text: She Yingwei; Photo: Provided by the interviewee; Editor: Zhang Wen dan; Deputy Editor: Shuai Yun