2022-08-20
"World Chip, Future Dream". From August 18 to 20 , the 2022 World Semiconductor Conference and Nanjing International Semiconductor Expo was held in Nanjing for three days. Lingyange Semiconductor Inc, a semiconductor enterprise under Foxconn Group, participated in the exhibition with many products and attended the 2nd International Automotive Semiconductor Innovation Collaboration Forum to interpret cutting-edge application technologies.
Attending the World Semiconductor Conference and Nanjing International Semiconductor Expo, LYG focused its products on high-performance computing chips, automotive microcontroller (MCU) chips and security chip design reference platform, as well as integrated solutions for 3D ToF optical sensors. During the exhibition at Booth A58, Hall 4 of Nanjing International Expo Center, many customers, colleagues, media reporters came to LYG's booth for business negotiations, technical exchanges and interview reports.
It is understood that LYG is an IC design service company of Foxconn Semiconductor Business Group in mainland China, with main business covering high-end chip design service, IP customized design service, EDA reference design process and verification, mass production service and system module design. It provides a chip technology service platform combining design, mass production and sales for domestic chip companies and system manufacturers, creating rapid, reliable and high-value solutions for customers, and providing one-stop services from product ideate to chip design, manufacturing, module and channel sales.
In the process and chip design collaborative optimization service, LYG provides a complete hardware and software solution, from the IP of wafer manufacturing variation monitoring system to the corresponding analysis software, to help improve chip yield. In order to meet the needs of wafer manufacturers, LYG also provides inspection and verification of PDK/FDK, inspection and verification of EDA reference design flow, to solve the problems faced by chip design companies in design and manufacturing. At the same time, LYG also provides design and mass production services for wafer-level packaging, fan-out packaging, and system-in-package, as well as reliable testing and fault analysis, advanced semiconductor packaging testing services. In terms of system module development, through the group and many domestic agents, first-line brands can be quickly introduced, and the appearance and specifications of customized module modifications can be reduced, which reduces the development burden on customer systems and can be directly used on Linux or Android platforms. It includes module products, AI visual application solutions, and ODM system design services.
The 2022 World Semiconductor Conference and Nanjing International Semiconductor Expo, as the first large-scale semiconductor industry event in the Yangtze River Delta region of China this year, covers an area of 20,000 square meters for professional exhibitions. It has four major exhibition areas: semiconductor design, manufacturing, testing, and equipment materials, gathering more than 300 high-quality enterprises. At the same time, groups from Shenzhen, Zhuhai, Tianjin, Dalian, and other places also participated in the exhibition, showcasing the technological innovation and application achievements in the field of domestic and foreign semiconductor industry across the entire industrial chain.
During the three-day conference, the conference also gathered superior resources to create more than 20 parallel forums and special events, including the 2022 Yangtze River Delta Integrated Circuit Industry Innovation and Development Forum, the 2nd International Automotive Semiconductor Innovation Collaboration Forum, the 1st Advanced Packaging Innovation Technology Forum, the Investment and Financing Sub-Forum, and the Core Power Product Launch Conference. In addition to participating in the exhibition, LYG was invited to participate in the parallel forum - the 2nd International Automotive Semiconductor Innovation Collaboration Forum. Roly Chen , Vice President of LYG, gave a keynote speech on "Design Reference Platform for Automotive Microprocessors and Security Chips", bringing new interpretations of cutting-edge technology applications.
LYG's "Design Reference Platform for Automotive Microprocessors and Security Chips" provides automotive microcontroller reference IP, development of PUF security chips and vehicle-specific safety certification and mass production reliability. It also develops automotive analog IP design that meets the ISO-26262 specification on the TSMC 40nm process. In addition to MCU, LYG has also added a Security module, more customized IP and interfaces, and provides as many clock frequency options as possible to meet diverse energy consumption needs.
As a young company that has only been established for more than 2 years, LYG is participating in the World Semiconductor Conference for the second time. In an interview with the media, Roly Chen stated that the 2022 World Semiconductor Conference and Nanjing International Semiconductor Expo provided a good opportunity for companies to showcase and exchange ideas. LYG will uphold the corporate culture of "customers, service, pragmatism, mutual trust, learning, and progress", integrate internal and external resources of the group, give full play to technological advantages and platform advantages, work with peers, and jointly build a prosperous era of domestic chip industry together.
The article is originally from Jie Mian News.