Packaging Service

LYG offer various packaging solutions. For example, wire bonding package, flipchip package, SiP package and advanced package like wafer level package and chiplet package.

Package development flow

Start from feasibility, package type evaluation to package design, process development, and eventually move into mass production, LYG has an optimized flow to speed up development cycle time and in the same time minimize the risks.

Package design and simulation

LYG has a strong capability on package design including leadframe package design, substrate layout design, RDL design, etc. Leverage our world-class level suppliers, we are able to apply appropriate and qualified rule on the design, thus to offer most optimized package solution.

LYG offers simulation service as well including electrical, thermal and mechanical simulation. Early stage co-design / co-verification is the key to the success. LYG is capable of system level simulations for co-work.

Advanced package solution

We have 2D MCM package and 2.3D RDL interposer package and 2.5D silicon interposer package to fulfill Chiplet package requirement.

2.3D chiplet package base on RDL interposer