About LYG
Lingyange Semiconductor Inc. was established in Hengqin in June 2020, with Hengqin headquarters R & D center and Zhuhai operation center.
LYG's main business is all-round customization services for chip design and system solutions, covering SoC chip design and IP customization services, chip mass production management, and application solution promotion. The business scope covers artificial intelligence, automotive electronics, biomedicine, smart city and other industrial applications.
The core members of LYG come from TSMC(TSMC), GUC, Broadcom, Intel, Arm and UNISOC and other world-renowned semiconductor companies, and the technical service team is distributed in Hengqin, Shanghai, Shenzhen, Macau and other places. The company has self-developed high-performance and high-reliability IP and high-end chip design and other core technologies.
The chip design services of LYG focus on the three target application areas of high performance computing chips, vehicle gauge chips and biomedical chips, and have helped industry customers complete the design and development and mass production of a number of cutting-edge chips and their application landing. LYG provides customers with complete chip design solutions to help customers complete the high efficiency AI acceleration engine SoC chip. LYG's first self-developed 40nm automotive MCU test chip has been successfully lit, using the self-developed RISC-V core and highly reliable analog IP, flexible modular design scheme, which can be extended to aviation and biomedical applications in the future.
LYG algorithm and system solution team is deeply engaged in the system integration of "intelligent vision and optical sensor", providing solution development services for chip customers, and helping customers with the application development and sales promotion of chips. In 2022, LYG established a joint laboratory with Zhuhai Macao University Science and Technology Research Institute, focusing on the application development of smart city and smart medical chip.
LYG algorithm and system solution team is deeply engaged in the system integration of "intelligent vision and optical sensor", providing solution development services for chip customers, and helping customers with the application development and sales promotion of chips. In 2022, LYG established a joint laboratory with Zhuhai Macao University Science and Technology Research Institute, focusing on the application development of smart city and smart medical chip.
Management team
LYG management team was established in 2018, the current scale of the company has more than 100 people, most of the technical team has more than 20 years of work experience in the semiconductor industry upstream and downstream, with profound integrated circuit design and development and mass production experience.
Albert Li
CEO
28 years of experience in semiconductor industry. Master's degree in Electrical engineering, specializing in advanced technology, low power, high performance chip design and process development. His work experience covers the semiconductor industry chain. He once worked for TSMC, a leading wafer foundry company, and was a member of the "Reference Design Process" and the "Open Innovation Platform" (OIP). He worked as the chip back-end engineering leader at the leading semiconductor manufacturers Broadcom and Intel, participated in the research and development of nano-scale physical design software at Cadence, the leader of electronic Aided design software (EDA), and led the team to complete the development of a number of EDA tools. In 2020, LYG was founded.
Sam Shieh
CTO
Sam Shieh has more than 30 years of experience in high-speed CMOS and BiCMOS IC design, as well as experience in enterprise and project leadership, organization and leadership skills, and extensive skills in analysis and problem-solving. He has served as Vice President of Verisilicon Inc., Vice President of Taiwan Etron, and VP, Board of Director of TM Technology, has also served as the technical leader of the R&D team at Broadcom and Nvidia. He received the ISSCC analog circuit conference presentation award in 1989. In the field of mixed analog-digital integrated circuits, especially in the high-frequency analog circuit PCI EXPRESS/SATA direction, he has rich experience in research and development and management, leading teams to successfully complete multiple international research and development projects.
He has more than 20 years of experience in corporate management, organizing, developing and leading multiple on-site engineering teams, personally experiencing cellular/chip-level circuit design and SERDES protocol testing, solid knowledge of submicron MOS/bipolar physics and transistor modeling, and rich experience in reverse engineering, AC and DC micro-probing, bench characterization and FIB micro-fixation.
Tyler E
General Manager
20 years experience in semiconductor industry. Master of Engineering, Master of Engineering, EMBA. Working in the semiconductor industry for more than 20 years, he is familiar with all aspects of chip design and production and operation, and has a deep understanding of integrated circuit industry ecology and its marketing work. And has rich experience in high-end process chip Design services, IP customization, Turnkey Service and maintaining good customer relationships in the Design Service business field.
Ray Hou
GM System Development
Executive Director, Lingyunge
20+ years of experience in R&D supervisor and marketing and sales operation. System field: computer motherboard/mobile phone motherboard/tablet motherboard design; Semiconductor field: Mobile phone chip/Wi-Fi chip/power supply and audio chip/wafer foundry and chip design services. Published more than 10 domestic and foreign invention patents, and obtained ISO26262 professional manager certification. In Sharp Semiconductor China sales operation management of more than 10 domestic agents to achieve a total turnover of 100 million yuan. Led the advanced ISP chip and algorithm team to obtain investment.
Kevin Wu
VP, R&D
GM, Lingyunge
18 years experience in semiconductor industry. Master of Microelectronics Engineering, specializing in chip design services and high performance low power design, specializing in advanced technology, low power, high performance chip design and process development. Initially, he worked in the chip design department of Texas Instruments, where he was responsible for baseband and Netcom chip development. Senior back-end engineer at Sondrel and chip design services at Intel.
Victor Pan
IP sales VP
25 years of experience in semiconductor industry. "China Integrated Circuit" and other professional journals published integrated circuit design IP and EDA related papers. He has worked in the former National Semiconductor Co., LTD., Trident, Agilent, Arm, SMIC, InnoSilicon and other IC design, testing, IP and IC manufacturing well-known enterprises.
Vienus Hong
CFO
With 23 years of working experience in finance and taxation, he has worked for more than 20 years in the finance and tax planning and internal control audit system of multinational group enterprises since 2001, providing enterprises with the overall finance and tax compliance design of supply chain system, national policy consultation for new enterprises, enterprise establishment guidance, professional consultation on cross-border equity investment finance/law/tax, application guidance for high-tech enterprises, IPO listing guidance; Provide comprehensive financial law and tax consulting services for high net worth individuals and family-owned enterprises; Served as the tax consultant of TOEA Taiwan Overseas Chinese Business Federation, Cross-Strait Business Operators Club and Taiwan Grand Health Alliance Association; Domestic technology industry supply chain tax consultant; Director of Guangdong Federation of Overseas Chinese Returnees Association, expert consultant of domestic and overseas Expert Committee, mediator of Mediation Center of Shenzhen Qianhai "Belt and Road" Legal Service Federation, arbitrator of Weihai International Arbitration Court, etc.
Dr. Zhongxing
Tech Consultant
30 years of semiconductor industry leadership experience. He holds a Ph.D. in computer engineering from the University of Illinois, and has more than 10 years of experience in Silicon Valley chip design industry, as well as rich experience in engineering management and entrepreneurship. I have rich experience in project leadership and management of EDA, design, verification and testing of large digital chips. He once worked for Wasion and led the development team in Beijing from more than 30 people to 200 people. After merging into mega core, the development of domestic x86CPU. Also involved in chip value-added business, distance education public welfare projects, as well as the Internet and EDA entrepreneurship.
The Certification of Patents
As a chip design service company,LYG has a professional R & D team in the industry. The company has applied for more than 50 core patents and intellectual property rights, and has passed intellectual property management system certification, ISO9001 management system certification, ISO26262 functional safety process certificate, etc.
Intellectual property management system certification
ISO9001 management system certification
ISO26262 Functional Safety Process Certificate
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